Hot-melt glue is a good choice for working with electronics, both for components and for potting and encapsulation.
When working with components hot-melt glue is controllable and a good insulator. However, you should avoid using it on power and thermally sensitive components. The heat given off by power components could possibly soften the hot-melt adhesive and compromise the hold. Furthermore, the adhesive is a thermal insulator. If the power component were to be covered in hot-melt adhesive, it would not be able to shed its heat, and thus fail.
Hot-melt glue is a quicker alternative to epoxy when potting and encapsulating. It sets quickly, is easy to manage, and is cost effective. Hot-melt glue also provides resistance to vibration; however, some manufacturers use silicon rubber for long term solutions.
Which Adhesive Does Your Electronics Application Require?
Deciding on the right adhesive for your electronics project doesn’t have to be a guessing game. Glue Machinery Corporation’s Glue Diligence® program can help you determine the electronics adhesive that will work best for your specific electronics application. Whether you need a fully automatic solution, or simply want to determine if there is a better hot-melt glue for your needs, our glue experts can help you find the best consumables and equipment. Fill out the form on this page or call us now at 866-274-7925 to find out more.